Oleg Khaykin Quotes
We are taking this step in close collaboration with Singapore's Economic Development Board, Chartered Semiconductor Manufacturing, and other customers who operate in Singapore. As wafer process technology continues to advance below 90nm, IC packaging will increasingly require advanced flip chip and wafer level solutions.
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We are taking this step in close collaboration with Singapore's Economic Development Board, Chartered Semiconductor Manufacturing, and other customers who operate in Singapore. As wafer process technology continues to advance below 90nm, IC packaging will increasingly require advanced flip chip and wafer level solutions.
- Oleg Khaykin
